Description
A high strength, non-shrinking, adhesive/potting compound specially formulated for high clarity, good impact strength, and water resistance. The adhesive bond is resistant to weathering, solvents, and wide variations in temperature.
Features
- 100% reactive, no solvents
- Good water and chemical resistance
- Fills gaps and voids
- Room temperature curing
Recommended Applications
- Bonding or potting electronic components and assemblies
- Creating moisture-resistant seals
- Suitable for bonding ceramics, ferrous and non-ferrous, ferrites, wood, glass and concrete