Description

A high strength, non-shrinking, adhesive/potting compound specially formulated for high clarity, good impact strength, and water resistance. The adhesive bond is resistant to weathering, solvents, and wide variations in temperature.

Features

• 100% reactive, no solvents
• Good water and chemical resistance
• Fills gaps and voids
• Room temperature curing

Recommended Applications

• Bonding or potting electronic components and assemblies
• Creating moisture-resistant seals
• Suitable for bonding ceramics, ferrous and non-ferrous, ferrites, wood, glass and concrete