• Devcon Devweld 530 and 531


Devweld_530

Description


Devweld_530 is a two-part 1:1 methacrylate adhesive designed for structural bonding of thermoplastic, metal and composite assemblies. Devweld_530 offers a combination of high strength and stiffness as well as the ability to bond a wide range of materials.

Features  


Room temperature cure

  • Non-sagging
  • Will fill gaps of up to 4mm
  • Excellent load bearing qualities
  • Resistant to weathering and humidity
  • Excellent shear, peel and impact strength
  • No surface preparation
  • 100% reactive

Devweld_531

Description


Devweld_531 is a two-part 1:1 ratio methacrylate adhesive designed for structural bonding of thermoplastic, metal and composite assemblies. Devweld_531 is particularly well suited for bonding thermoplastic materials and combines high strength and stiffness with the ability to adhere difficult-to-bond materials.

Features

  •  Excellent shear, peel and impact strength
  • Non-sagging
  • Will fill gaps of up to 4mm
  • Excellent load bearing qualities
  • Resistant to weathering and humidity
  • Specifically designed for difficult-to-bond substrates
  • Room temperature cure
  • No surface preparation
  • 100% reactive

Devcon Devweld 530 and 531

  • Manufacturer: Devcon
  • Availability: In Stock